JPS6181154U - - Google Patents
Info
- Publication number
- JPS6181154U JPS6181154U JP16526384U JP16526384U JPS6181154U JP S6181154 U JPS6181154 U JP S6181154U JP 16526384 U JP16526384 U JP 16526384U JP 16526384 U JP16526384 U JP 16526384U JP S6181154 U JPS6181154 U JP S6181154U
- Authority
- JP
- Japan
- Prior art keywords
- connecting part
- lead
- lead frame
- protruding
- protruding reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 3
- 238000005553 drilling Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16526384U JPS6181154U (en]) | 1984-10-31 | 1984-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16526384U JPS6181154U (en]) | 1984-10-31 | 1984-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181154U true JPS6181154U (en]) | 1986-05-29 |
Family
ID=30723118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16526384U Pending JPS6181154U (en]) | 1984-10-31 | 1984-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181154U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0567005U (ja) * | 1992-02-15 | 1993-09-03 | 日本電気株式会社 | 半導体装置用リードフレーム |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5354473A (en) * | 1976-10-27 | 1978-05-17 | Nec Corp | Lead frame for semiconductor |
| JPS5524451A (en) * | 1978-08-08 | 1980-02-21 | Nec Kyushu Ltd | Lead frame for semiconductor |
| JPS58219756A (ja) * | 1982-06-15 | 1983-12-21 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
| JPS5936955A (ja) * | 1982-08-25 | 1984-02-29 | Shinko Electric Ind Co Ltd | リ−ドフレ−ム |
-
1984
- 1984-10-31 JP JP16526384U patent/JPS6181154U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5354473A (en) * | 1976-10-27 | 1978-05-17 | Nec Corp | Lead frame for semiconductor |
| JPS5524451A (en) * | 1978-08-08 | 1980-02-21 | Nec Kyushu Ltd | Lead frame for semiconductor |
| JPS58219756A (ja) * | 1982-06-15 | 1983-12-21 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
| JPS5936955A (ja) * | 1982-08-25 | 1984-02-29 | Shinko Electric Ind Co Ltd | リ−ドフレ−ム |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0567005U (ja) * | 1992-02-15 | 1993-09-03 | 日本電気株式会社 | 半導体装置用リードフレーム |